The report "Semiconductor
Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning,
Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing,
Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global
Forecast to 2029" The Semiconductor Manufacturing Equipment market is
expected to reach USD 155.09 billion by 2029, up from USD 109.24 billion in
2024, at a CAGR of 7.3% from 2024 to 2029. The rising demand for semiconductor
in automotive sector, increasing need for advanced and efficient chips, and
expansion of the semiconductor fabrication facilities are some of the major
factors contributing to the growth of the semiconductor manufacturing equipment
market. Moreover, opportunities such as advancements in packaging technologies
and government initiatives for domestic semiconductor industry drive the market
growth.
The key advantages of
semiconductor manufacturing equipment are precision and high throughput, which
enable very small and much more powerful chips at large-scale volume
production. They include scalling for growing technologies, contain advanced
process control for yield and quality optimization. They offer flexibility to
accommodate various chip types, supporting energy efficiency in a bid to even
further minimize impacts on the environment and enable using other advanced
techniques like 3D stacking.
IDM firms to dominate
the supply chain participant segment of the market during the forecast period.
IDM firms will drive the
growth of supply chain participant in the semiconductor manufacturing equipment
market due to the increasing manufacturing capabilities for high-performance
chips, and declining dependency on outside suppliers for better cost efficiency
and control. An IDM is a company that has the semiconductor-making processes
in-house. This includes all design and manufacturing activities, so they are
fully in control of the whole production cycle. An IDM designs, manufactures,
and markets their own semiconductor chips. They have their fabrication plants.
They own and operate them and have special tools for wafer fabrication,
lithography, testing, and packaging. This creates a vertical integration by
which IDMs can maintain stiff quality control, maximize the acceleration of
innovation cycles, and respond quickly to the market's demands. Integrated
device manufacturers have control over their value chains as compared to
fabless semiconductor companies.
Deposition to register
the highest CAGR in the market during the forecast period.
The deposition equipment
is expected to register highest CAGR. Growth in the semiconductor manufacturing
equipment market will be advancements in deposition processes, such as CVD,
PVD, and ALD, together with the rising demand for high-performance and miniaturized
semiconductor devices. The deposition equipment market is driven by the need
for advanced nodes, 3D ICs, and advanced packaging solutions, requiring
precision in multilayer structures. Continued demand for the new
high-performance devices such as Al and 5G, and memory technologies like 3D
NAND, supports this market. The emphasis on energy efficiency along with Al and
automation integration in the deposition systems are other emerging trends and
help optimize process control, yield, and overall efficiency. Such trends are
shaping the deposition equipment market as manufacturers seek solutions to
support higher complexity, performance, and sustainability in semiconductor
devices.
Americas registered the
second-highest CAGR during the forecast period.
Americas is likely to
account for the second-highest CAGR in the semiconductor manufacturing
equipment market based on several key factors. The region has strong market
presence of leading tech companies and has a robust R&D infrastructure that
promotes continuous innovation in the technology for semiconductor
manufacturing equipment. Major players-leaders in the market in terms of
quality of semiconductor manufacturing equipment-have been Applied Materials,
Inc. (US), LAM Research Corporation (US), KLA Corporation (US), Teradyne, Inc.
(US), and Plasma-Therm (US). The increased investment in new fabs, adoption of
the most advanced manufacturing technologies, such as EUV lithography, and
strategic partnerships between semiconductor firms and equipment manufacturers
augment growth in the market. These factors combine well to ensure high and
immense growth in Americas in the area of semiconductor manufacturing
equipment.
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Key players
The report profiles key
players such as include Applied Materials, Inc. (US), ASML (Netherlands), Tokyo
Electron Limited (Japan), Lam Research Corporation (US), KLA Corporation (US),
SCREEN Holdings Co., Ltd. (Japan), Teradyne, Inc. (US), Advantest Corporation
(Japan), Hitachi High-Tech Corporation (Japan), and Plasma-Therm (US). These
players have adopted various organic and inorganic growth strategies such as
product launches, expansions, partnerships, collaborations, acquisitions, and
agreements.
The Wall